Chip Structure

  • Base Layer : P-SiO
  • Metal Layer : TiN / AI-Si
  • Passivation Layer : P-SiO / P-SiN (option) Polymide



Wafer size φ300mm
Wafer Thickness 775±25um
Chip size 25mm * 25 mm (Scribe center to center)
Pad (bump)pitch 150μm
Function Daisy Chain
Electrode Cu pillar (Cu30μm+SnAg15μm)
Bump size φ75μm
Passivation opening 40μm (octagon)
Polyimide opening φ40μm
Scribe line width 100μm
Number of pad 25,921 pads (161×161 Matrix)

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New Product

.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor


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In the News

Practical Components to Exhibit at the IPC High Reliability Forum
Practical is announcing that it will display its latest technology at the upcoming IPC High Reliability Forum and exhibition scheduled to take place May 15-17, 2018 in ... [read more]

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