HPWTEG-150FA-0101JY & HPWTEG-300FA-0101JY


Specifications HPWTEG-150FA HPWTEG-300FA
Base Wafer HPW-0101JY HPW-0101JY
Electrode Ni + SnAg Bump Cu Pillar Bump
Bump Pitch 150μm 300μm
Bump Size φ110μm φ110μm
Bump Height Ni5μm+SnAg75μm Cu50um+SnAg10um
Passivation Opening 70μm (Octagon) 70μm (Octagon)
Polyimide Opening φ90μm φ90μm
Number of Pad 32 pads 32 pads
Number of Bump 32 bumps + 253 Dummy bumps 32 bumps + 64 Dummy bumps
<Option> Back Side Metallization Back Side Metallization

IPC Validation Services

New Product

.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor


Technical Center

In the News

Practical Components to Exhibit at the IPC High Reliability Forum
Practical is announcing that it will display its latest technology at the upcoming IPC High Reliability Forum and exhibition scheduled to take place May 15-17, 2018 in ... [read more]

Request Catalog


Request or download our catalog and sign-up for our newsletter.