Specifications TYPE-A TYPE-B
Wafer Size 6 inch 6 inch
Wafer Thickness 625±25μm 625±25μm
Chip Size 6.0mm ♦ 6.0mm ♦
Metal Thickness Al-Si 3μm Al-Si 4.5μm
Function BondabilityCheck BondabilityCheck
Pad config Plane Plane
Pad Size 5060μm × 2420μm 5060μm × 2420μm
270μm 5300μm 270μm × 5300μm
Passivation opening 5040μm × 2400μm 5040μm × 400μm
250μm × 5280μm 250μm × 5280μm
Scribe width 100μm 100μm
    ♦ Bottom Side

IPC Validation Services

New Product

.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor


Technical Center

In the News

Practical Components to Exhibit at the IPC High Reliability Forum
Practical is announcing that it will display its latest technology at the upcoming IPC High Reliability Forum and exhibition scheduled to take place May 15-17, 2018 in ... [read more]

Request Catalog


Request or download our catalog and sign-up for our newsletter.