Wafer Size 6inch(OrientationFlat)
Wafer Thickness 550±25μm
Chip Size 3.0mm ♦
Pad Pitch 300μm
Function Stress Analysis by Piezoresistance
Thermal Analysis by Diode
Heat Generation by Resistance
Electrode Al pad
Cu Pillar Bump
Solder Bump
Au Bump
Pad Size 120μm ♦
Passivation Opening 70μm (Octagon)
Polyimide Opening φ90μm
Scribe Line Width 80μm
Number of Pad 32pads
<Option> Back Side Metallization
  ♦ Bottom Side

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.4mm Pitch eWLP Dummy Wafer-Amkor
.4mm Pitch eWLP Dummy Wafer-Amkor


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In the News

Practical Components to Exhibit at the IPC High Reliability Forum
Practical is announcing that it will display its latest technology at the upcoming IPC High Reliability Forum and exhibition scheduled to take place May 15-17, 2018 in ... [read more]

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