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*HDP : High Density Plasma
Specifications | |
Wafer Size | 8 inch |
Wafer Thickness | 725±25μm |
Chip Size | 7.3mm ♦ |
Pad Pitch | 60μm |
Function | Daisy Chain |
Bump Size | - |
Bump Height | - |
Number of Pad | 488 pads/chip |
Number of Chip | 478 chips/wafer |
Polyimide (Option) | O |
Evaluation KIT | - |
♦ Bottom Side |