Privacy Policy Update
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*HDP : High Density Plasma
Specifications | CC80TSV-1 | CC80TSV-2 | ||||||||||||
Wafer Size | 8 inch | 8 inch | ||||||||||||
Wafer Thickness | 100μm | 100μm | ||||||||||||
Chip Size | 7.3mm ♦ | 7.3mm ♦ | ||||||||||||
Pad pitch | 80μm staggered (Peripheral) 300μm Full area (Center core) |
80μm staggered (Peripheral) 300μm Full area (Center core) |
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TOP Side |
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BOTTOM Side |
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Scribe width | 120μm | 120μm | ||||||||||||
♦ Bottom Side |